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[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*